For budget-minded tech lovers, the Intel SMARTi UE2p system-on-chip solution might just reduce the overall cost of 3G handsets and tablets incorporating it. The SoC is mostly aimed at consumer segments like machine-to-machine modules and entry level 3G cell phones.
The piece of Intel hardware basically affixes the 3G power amplifiers right into the radio frequency circuits as one SoC solution rather than complicating it by employing separate components for each purpose. Not only does this result in a compact form factor by reducing the number of integrated components, but it also cuts down on the total cost involved in the development process.
“The SMARTi UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity,” asserted Stefan Wolff, vice president of the Intel Architecture Group and general manager of Multi-Com. “This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the ‘Internet of things.”
In technical terms, the chipset amalgamates the HSPA Intel 3G radio frequency transceiver and the 3G power amplifiers onto a 65nm silicon die. This power management solution is coupled with the sensors to provide a direct link to the concerned gadget’s battery. In order to run the chip for various 3G dual band configurations, manufacturers will have to club it with Intel’s XMM62xx HSPA modem series.
The Intel SMARTi UE2p is slated to be available for interested manufacturers by October this year. Hopefully, we may see relatively inexpensive 3G-enabled handsets carrying the SoC by early 2013.