Not to be left behind by Qualcomm, MediaTek has announced its Dimensity 9300 chipset that’s primed to enter flagship smartphones from China next year. Claimed to be 33 percent more power efficient than its predecessor, it carries onboard a new and advanced GPU as well.
This latest chipset from MediaTek is built on TSMC’s third-generation 4nm process technology and is headlined by a single prime core that comes in the form of a Cortex-X4 unit clocked at 3.25GHz. It’s accompanied on the CPU by three more Cortex-X4 cores clocked at a lower 2.85GHz.
As for the performance cores, four Cortex-A720 units serve this purpose, running at 2.0GHz. The recently launched Snapdragon 8 Gen 3 SoC from Qualcomm has been equipped with five A720 performance cores with a clock speed of up to 3.2GHz.
Coming back to the MediaTek Dimensity 9300, compared to the Dimensity 9200 model, it not only offers a 33 percent improvement in power efficiency but also provides a 40 percent boost to the multi-core performance.
Additionally, it marks the debut of Arm’s 12-core Immortalis-G720 MC13 GPU, which supports hardware-based ray tracing. This newly crafted GPU, moreover, is apparently 46 percent more powerful than its predecessor and is claimed to use 40 percent less power.
AI capabilities haven’t been overlooked by MediaTek. The Dimensity 9300 possesses enhanced AI capabilities courtesy of the upgraded APU 790 AI processing unit.
This new offering from MediaTek delivers support for LPDDR5T RAM as well as UFS 4.0 storage. It will be able to power WQHD displays with a refresh rate of up to 180Hz. Up to 320MP camera sensors are supported, along with Wi-Fi 7 and Bluetooth 5.4.
The new MediaTek Dimensity 9300 chip is all set to be deployed in flagship smartphones from Vivo, OnePlus, Oppo, and Redmi next year.