It was just today that we reported on Intel unveiling its XMM 6260 platform for 3G smartphones. In its bid to expand the range of solutions offered, Intel Mobile Communications has announced the availability of the XMM 2138 platform for dual-SIM dual-standby (DSDS) operation.
The XMM 2138 platform is based on the X-GOLD 213 EDGE baseband chip which is a low-cost single-chip solution for mobile internet browsing. The package includes power management, RF transceiver, GSM baseband, mixed signal, FM radio in 65nm CMOS technology along with the 8×8 mm eWLB-217 lead-free package of the X-GOLD 213. This combination shows itself in a compact and slim form factor.
Most active dual-SIM handsets come with two transceivers. But this new technology enables delivery of the same performance using only one transceiver, further aiding cost savings. A DSDS mobile offers users the ability to rake in the benefits of two devices while on the move. In the few years to come, it is expected that dual-SIM handset markets across the Asian-Pacific countries will experience a significant growth rate.
“With this dedicated, cost-effective design platform we again underline our commitment to provide complete and scalable solutions for all market segments, from ultra low-cost devices to high-end smart phones,” expressed Dr. Hermann Eul, president of Intel Mobile Communications. “The XMM 2138 is available in two flavors; the UTA-based XMM 2138 platform offering Tier 1 customers maximum re-use and design flexibility while the turnkey platform enables mobile phone manufacturers to produce optimized and cost-effective products with short time-to-market for the increasing demand for Dual-SIM handsets.”
Additionally, this new platform will enable mobile phone manufacturers to offer affordable solutions addressing the increasing demands of the dual-SIM market. This DSDS platform also supports WQVGA displays and touchscreens to provide an enhanced mobile internet browsing experience, WLAN connectivity options and Bluetooth capability for file sharing. The ARM11 core in the X-GOLD 213 and on-chip incorporated FM radio presents high video and audio performance. Moreover, it provides manufacturers with a scalable path from 2G to 3G networks and low-cost PCB manufacturing.
The XMM 2138 platform is currently available for commercial distribution in the markets.