SamsungSamsung launches 1GHz A8 based application processors

Samsung launches 1GHz A8 based application processors

Samsung Logo Samsung further elevates innovation as the handset manufacturer is keen on introducing ‘PC-like’ mobile phones and the introduction of two new 1GHz Arm Cortex A8 based application processors, the S5PC110 and the S5PV210 seem to be a step towards achieving this goal. These processors were launched for advanced mobile devices at the sixth annual Samsung Mobile Solutions Forum.

The S5PC110 is designed especially for small connected devices like multimedia intensive smartphones. However, the S5PV210 is targeted towards portable computing devices such as netbooks. Both these processors provide longer battery life for mobile devices that work on standard size batteries. This is made possible by employing a number of low power technologies, such as the use of a 45-nanometer Low Power fabrication process and complex low power architectures.

“More and more, user generated content currently accessed via the PC will be spread to mobile devices. PC-level performance with lower power consumption will become mainstream requirements for advanced mobile devices. Samsung developed S5PC110 and S5PV210 application processors to satisfy these conflicting requirements to enable a new level of user experience not previously possible,” mentioned Dr. Kwang Hyun Kim, senior vice president, strategic marketing team, System LSI Division, Samsung Electronics.

The processors offer 32KB data and 32KB instruction caches, and comprise of a 512KB L2 cache. With such a huge amount of L2 cache and an amazing clock speed of 1GHz, real-time applications such as web browsing and user interface run efficiently with a fast response time. They are equipped with a robust 3D graphics engine that supports premium 3D UI and high-end games. The Samsung devices are inclusive of a 1080p full HD codec engine that supports 30fps full HD video playback and recording.

The S5PC110 is placed in a 0.5mm pitch, 14 x 14mm2 FBGA package that facilitates package-on-package vertical stacking of low power, multiple chip package memory such as OneDRAM, mobile DDR and LP DDR2.

Customer samples of both products will be offered in December, this year.

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