OmniVision has come out with a breakthrough technology which offers an easier approach to mobile phone design. The new CameraCube technology acts as a 3-dimensional total camera solution which brings together the full functionality of a single- chip image sensor, embedded image processor along with wafer level optics into one compact, small-footprint package.
James He, OmniVision’s Chief Operating Officer, has stated, “Today’s announcement represents the culmination of years of strategic planning. We carefully identified the elements needed to develop a small footprint, total camera solution. We made a strategic investment in the supply chain with VisEra Technologies, brought the expertise required in-house through our acquisition of OmniVision CDM Optics, and collaborated with the industry’s leading wafer-level lens suppliers.”
The CameraCube technology has the ability to simplify the mobile phone design significantly. Firstly, it allows mobile phone manufacturing to be significantly streamlined due to its all in one camera solution. The beauty of this technology is that it can be directly soldered to the printed circuit board without the need for any socket or insertion. This translates into quicker time-to-market and cost-efficiency for mobile manufacturers.
In addition, the device removes the need for flex cables and interposers by utilizing wafer level alignment tools. With this, the lens can be placed added to the CSP image sensors straightaway. The CameraCube device also comes equipped with a thermal tolerance of up to 260 degrees C. This feature, combined with its ultra small size, makes it perfect for numerous developing markets like notebook PC, surveillance, automotive and medical cameras.
More importantly, OmniVision’s special technology has produced the industry’s smallest profile and z-height (diminished to 2.5 X 2.9 X 2.5 mm), which fits perfectly with the current ultra slim mobile phones. It will initially be aimed at the lower end of the mobile market.
So far, OmniVision has introduced 2 devices, the OVM6680 (400 x 400) and OVM7690 (VGA) that are available in volume production. More devices, dependant on this new technology, are expected to be unveiled during the course of 2009.